Device Modeling Engineer
Texas Instruments India · Bengaluru · On-site (inferred from location)
- Pay
- Not disclosed
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- Work setup
- On-site (inferred from location)
- Employment
- Full-time (inferred)
- Discipline
- Process/Fab
Skills
- SPICE compact modeling (BSIM, MEXTRAM, HICUM, ASM)
- parameter extraction (ICCAP, BSIMPROPLUS, MBP)
- Cadence / Spectre simulation
- Verilog-A
- MATLAB
- Python
- TCAD
- statistical analysis of large datasets
Added by ChipJobs from Texas Instruments India's careers page · Posted · 183 days ago · Checked
About the role
Compact (SPICE) device modeling engineer in TI's Bangalore-based SPICE Modeling Group, extracting and developing compact models for advanced semiconductor devices (MOS, LDMOS, DEMOS, BJT, GaN, RF, sensors, NVM, RAM) and partnering with analog, digital, mixed-signal, and process technology teams to deploy modeling solutions for TI's next-generation automotive, industrial, and embedded products.
How we checked this listing
| What we checked | Result | When |
|---|---|---|
| Is this a real posting on the employer's own site? | Opened by hand on Texas Instruments India's own careers page and entered here. It was live at the time. | 29 Aug 2026 |
| Who put it here? | We found this on Texas Instruments India's careers page and entered it by hand. The employer has not confirmed it with us. | — |
| Does it have a salary range? | No. The employer does not publish a pay band on this posting. | — |
| Is it still live today? | We have not completed a source re-check since it was entered by hand. It remains marked unchecked. | 29 Aug 2026 |
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Originally posted on the employer's careers page by Texas Instruments India. ChipJobs links to the employer’s own posting and reproduces no content from LinkedIn, Indeed, Glassdoor or Naukri.
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